3D stencil
3D stencil is the stencil to mount IC packages and passive components on a cavity PCB in order to decrease the mounting both space and height enabling both miniaturization and a high function on circuit.
Features
- High uniformity of solder paste volume
- High-Productivity by one time printing
| Printing and dispensing method | One time printing method | |
|---|---|---|
 |
 |
|
| Productivity | Low efficiency | High efficiency |
| Quality | Unstable | Stable |
