Technology of step up/down
Standard step down
■This is the technique to decrease thickness
against high aspect ratio components.
Step up
■This is the technique to increase thickness
when the components need solder paste
volume.
“Nameraka”step
■This is the special technique to decrease
the edge on step area so that you
reduce a burden of the squeegee.
Step down on PCB side
■This is the technique to avoid the
uneven surface.
