Stencil products

Technology of step up/down

Covered by ISO

Standard step down

■This is the technique to decrease thickness
 against high aspect ratio components.

Step up

■This is the technique to increase thickness
 when the components need solder paste


■This is the special technique to decrease
 the edge on step area so that you
 reduce a burden of the squeegee.

Step down on PCB side

■This is the technique to avoid the
 uneven surface.

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