Stencil products

Bump stencil

This is the stencil for C4 bumping made by using high precision additive process. This stencil provides excellent thickness accuracy, opening accuracy, position accuracy and reproducibility for repeat order.

Covered by ISO


  • The solder paste passing through property is very good because of smooth aperture wall roughness.
  • Provide excellent in thickness accuracy and position accuracy
  • Provide high adaptability to solder paste volume required

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