Option
Technology of step up/down
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Standard step down
This is the technique to decrease thickness against high aspect ratio components. -
Step up
This is the technique to increase thickness when the components need solder paste volume. -
“Nameraka”step
This is the special technique to decrease the edge on step area so that you reduce a burden of the squeegee. -
Step down on PCB side
This is the technique to avoid the uneven surface.
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